Study the result of multiple physical factors acting simultaneously, by combining results from multiple analysis types to help predict a product’s real-world performance.
Advanced simulation setup is made easier through the use of standard engineering terminology, visual process guidance, and user-friendly tools and wizards that automate the transfer of simulation results among multiple analyses.
Fluid and Thermal Analysis
- Calculate effects of fluid motion on the heat transfer of an assembly and the effects of temperature distribution on flow pattern. Applications include fan-cooled electronics, heat exchangers, and systems that operate at extremely high temperatures.
- Use natural convection (buoyancy) capability to account for flow changes caused by temperature differences in fluids.
- Use forced convection capability to consider effects of fluid flow when solving for temperature distribution.
- Determine the fluid velocity necessary to produce the desired temperature distribution and help prevent part failure.
- View fluid flow and heat transfer results simultaneously for applications with both natural and forced convection (mixed convection).
Thermal Stress Analysis
Apply temperature results from a heat transfer analysis as thermal loads in a structural analysis, to determine if resulting deflections and stresses may cause otherwise suitable parts to fail.
Fluid and Structural Analysis
Input results from a computational fluid dynamics (CFD) analysis as loads in a structural analysis. This loosely coupled fluid-structure interaction lets you analyze effects of fluid flow on a structure.
Electrostatic Analysis
- Determine voltage and current distribution when an electric potential is applied to a conductive material.
- Study electric fields around objects and analyze dielectrics—insulating materials polarized by electric fields.
- Study an assembly’s electric conduction properties and test whether designs exceed the ielectric strength of capacitors and surrounding media.
Joule Heating Analysis
Simulate joule heating effects by linking the results of an electrostatic analysis to a heat transfer analysis. This capability is useful when analyzing spot welding, circuit breakers, microelectromechanical systems (MEMS), and electronic devices.
Electromechanical Analysis
- Determine how voltage relates to structural response.
- Calculate the strain in a piezoelectric material due to voltage distribution.
- Link the voltage distribution and electrostatic forces calculated by an electrostatic analysis to structural analysis tools.
